• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a device and a method for mounting components (1) on a substrate (2). The device comprises a bondhead (3) with a component gripper (11), a first drive system (6) for moving a carrier (7) over relatively large distances, a second, on the carrier (7) fixed drive system (8) to the back and Moving the bonding head (3) between a nominal working position and a standby position, a drive (14) attached to the bonding head (3) for rotating the component gripper (11) or a rotary drive (15) for rotating the substrate (2) around one Axis, at least one on the substrate (7) fixed substrate camera (10) and at least one component camera (9). Either the second drive system (8) is also designed to perform with the bonding head (3) high-precision correction movements, or there is a third drive system to perform high-precision correction movements with the substrate (2). At least one reference mark is attached to the bonding head (3) or to the component gripper (11).
    公开号:CH713732A2
    申请号:CH00427/18
    申请日:2018-04-03
    公开日:2018-10-31
    发明作者:Bilewicz Norbert；Mayr Andreas；Pristauz Hugo；Selhofer Hubert
    申请人:Besi Switzerland Ag；
    IPC主号:
    专利说明:

    description
    Technical Field The invention relates to a device for mounting components, typically electronic or optical components, in particular semiconductor chips and flip chips, on a substrate. In the professional world, assembly is also known as the bonding process or assembly process.
    Background of the Invention Devices of this type are used particularly in the semiconductor industry. Examples of such devices are die bonders or pick-place machines, with which components in the form of semiconductor chips, flip chips, micromechanical, micro-optical and electro-optical components, and the like, are deposited and bonded on substrates such as, for example, lead frames, printed circuit boards, ceramics, etc. The components are picked up by a bonding head at a removal location, in particular sucked in, moved to a substrate location and placed on the substrate at a precisely defined position. The bondhead is part of a pick and place system that enables movements of the bondhead in at least three spatial directions. So that the placement of the component on the substrate can take place in an exact position, both the exact position of the component gripped by the bonding head with respect to the positioning axis of the bonding head and the exact position of the substrate location must be determined.
    The mounting devices available on the market achieve at best a placement accuracy of 2 to 3 micrometers with a standard deviation of 3 sigma.
    BRIEF DESCRIPTION OF THE INVENTION The object of the invention is to develop a device and a method which achieve a higher placement accuracy compared to the prior art.
    The invention consists in the features specified in claims 1 and 6. Advantageous configurations result from the dependent claims.
    The inventive device comprises a bondhead with a component gripper, a first drive system for moving a carrier over relatively large distances, a second drive system attached to the carrier for moving the bondhead back and forth between a nominal working position and a stand-by position, a drive attached to the bondhead for rotating the component gripper or a rotary drive for rotating the substrate about an axis running perpendicular to the substrate surface, at least one substrate camera attached to the carrier and at least one component camera. The bondhead or the component gripper contains at least one reference marking, which is used both by the at least one component camera and the at least one substrate camera in order to determine the position of the component relative to the bondhead or the position of the bondhead relative to the substrate location. The substrate contains at least one substrate marking and the component at least one component marking or a structure suitable as a component marking.
    The first drive system is used to move the bondhead over relatively large distances with relatively low position accuracy. The second drive system is used to move the bond head back and forth between the nominal working position and a stand-by position. In the nominal working position, the bondhead covers the substrate marking (s) attached to the substrate and is therefore temporarily brought into the standby position, where the bondhead no longer covers the substrate marking (s), so that the substrate camera (s) Can take a picture of the substrate marking (s). The second drive system also preferably serves to move the bondhead over relatively small distances with very high positional accuracy, i.e. for performing high-precision correction movements of the bondhead. Alternatively, a third drive system can be provided in order to carry out high-precision correction movements of the substrate.
    The invention is explained below with reference to exemplary embodiments and with reference to the drawing. The figures are schematic and are not drawn to scale.
    Description of the Figures
    1 schematically shows a first exemplary embodiment of a device according to the invention for mounting components on a substrate,
    2 schematically shows a second exemplary embodiment of a device according to the invention for mounting components on a substrate, and
    3-5 show snapshots during the assembly process according to the invention.
    CH 713 732 A2
    DETAILED DESCRIPTION OF THE INVENTION FIG. 1 shows schematically a first exemplary embodiment of an inventive device for mounting components 1 on a substrate 2. The substrates 2 contain at least one substrate marking 23 (FIG. 3). The components 1 are, in particular, flip chips, but also other semiconductor chips. The components 1 can also be electronic, optical or electro-optical or any other components that can be assembled with a precision in the micrometer or submicrometer range.
    The mounting device comprises a bondhead 3, a feed unit 4 for feeding the components 1, a device 5 for feeding and providing the substrates 2, and a first drive system 6 for a carrier 7 and a second drive system 8 for the bondhead 3. The second drive system 8 is attached to the carrier 7. The device further comprises at least one component camera 9 and at least one substrate camera 10. The substrate camera (s) 10 is / are attached to the carrier 7. The bond head 3 comprises a component gripper 11 which can be rotated about an axis 12. In the following, a component which is held by the bonding head 3 is referred to as component 1 a. The component gripper 11 is, for example, a suction element which can be acted upon by vacuum and which sucks a component 1.
    The feed unit 4 comprises, for example, a wafer table, which in each case provides a multiplicity of semiconductor chips, and a flip device, which removes one semiconductor chip after the other from the wafer table and provides it for transfer as a flip chip to the bonding head 3. The feed unit 4 can also be a feed unit that provides flip chips or other components one after the other for transfer to the bondhead 3.
    The bond head 3 or the component gripper 11 contains at least one reference mark 13 (FIG. 3). advantageously at least two reference markings 13 so that both a displacement of the component 1a held by the component gripper 11 of the bonding head 3 and a rotation of the component 1a from its target position can be detected and corrected. The reference mark (s) 13 is / are attached to the bondhead 3 or to the component gripper 11 such that they are / are visible in the image supplied by the component camera 9 or the images supplied by the component cameras 9 when the bondhead 3 is in the Field of view of the component camera 9 or the fields of view of the component cameras 9, and is / are visible in the image supplied by the substrate camera 10 or the images supplied by the substrate cameras 10 when the bonding head 3 is in the field of view of the substrate camera 10 or the fields of view the substrate cameras 10 is located. The reference marking (s) 13 is / are formed, for example, as a cross in the hole (s) in the component gripper 11, and is / are preferably formed on a plate made of glass in the form of structures made of chromium. Glass is transparent so that the reference mark (s) 13 can be seen from above and from below and thus from all cameras 9 and 10. A glass with a very low coefficient of thermal expansion is preferably chosen. The thickness of the glass plate is advantageously selected such that, at a certain height of the bonding head 3 above the substrate 2, both the reference mark (s) 13 and the substrate mark (s) 23 with sufficient sharpness in that of the substrate camera (s) 10 captured image are shown, ie that both the reference mark (s) 13 and the substrate mark (s) 23 are in the depth of field of the substrate camera (s) 10.
    The first drive system 6 serves to transport the bondhead 3 over relatively long distances, namely from a component removal location, where the bondhead 3 takes over the component 1 to be assembled from the feed unit 4, to the substrate 2, where the bondhead 3, the component 1a is placed on a substrate location of the substrate 2. The requirements for the positional accuracy of the first drive system 6 are relatively modest, a positional accuracy of +/- 10 pm is usually sufficient. The first drive system 6 is designed, for example, as a so-called "gantry" with two or more mechanically highly stable movement axes, of which two movement axes enable movements of the carrier 7 in two horizontal directions running perpendicular to one another.
    The up and down movements of the bonding head 3 for removing a component 1 from the feed unit 4 and the placement of the component 1 a on the substrate location of the substrate 2 can be done in various ways, for example
    the first drive system 6 contains a third, highly stable movement axis for the up and down movement of the carrier 7,
    the second drive system 8 contains an additional, highly precise drive for the up and down movements of the bondhead 3,
    - The bond head 3 contains a highly accurate drive for up and down movements of the component gripper 11, which is advantageously air or ball bearing.
    The device can contain only one, or two or all three of the movement axes / drives mentioned for the up and down movements.
    The second drive system 8 serves on the one hand to move the bonding head 3 into a stand-by position, as explained in more detail below, and on the other hand to enable high-precision correction movements of the bonding head 3 in two different horizontal directions. The second drive system 8 comprises a first drive for moving the bondhead 3 along a first direction, referred to as the u direction, and a second drive for moving the bondhead 3 along a second direction, referred to as the v direction. The directions u and v run in the horizontal direction and preferably orthogonally to one another. The bonding head 3 optionally includes a drive 14 for rotating the component gripper 11 about the axis 12. The device 5 for feeding and providing the substrates 2
    CH 713 732 A2 can contain a rotary drive 15 in order to rotate the substrate 2 about an axis running orthogonally to its surface, in order to alternatively eliminate possible angular errors in this way.
    The component camera 9 or the plurality of component cameras 9 serve to detect the position of the component 1 a in relation to the position of the reference mark (s) 13. The substrate camera 10 or the plurality of substrate cameras 10 serve to record the position of the substrate location on which the component 1 a is to be placed in relation to the position of the reference mark (s) 13. Each component camera 9 and each substrate camera 10 comprises an image sensor 17 and an optical system 18 (FIG. 3). The optics 18 of the substrate camera (s) 10 include, for example, two deflection mirrors 19.
    The component camera (s) 9 is / are, for example, arranged stationary on the device and the bonding head 3 is moved on the way from the component removal location to the substrate location via the component camera (s) 9 and is preferred, but not mandatory, for the recording paused one or more pictures. The component camera (s) 9 can, however, also be attached to the carrier 7. For example, either the component camera (s) 9 or the bonding head 3 is attached to the carrier 7 by means of a swiveling mechanism that can be folded in and out. The component camera (s) 9 or the bonding head 3 is then folded into an image recording position during the journey from the component removal location to the substrate location, so that one or more images per component camera 9 can be recorded during the journey. For the removal of the component 1 from the feed unit 4 and for the recordings with the substrate camera (s) 10 and for placing the component 1a, the component camera (s) 9 is placed in a stand-by position and the bonding head 3 in its working position collapsed.
    The range of motion of the second drive system 8 is relatively small and even very small compared to the range of motion of the first drive system 6. The second drive system 8 must on the one hand be able to move the bondhead 3 from a nominal working position to the stand-by position in which the Substrate markings 23 are not covered by the bonding head 3 and, on the other hand, enable high-precision correction movements of the bonding head 3 in two different horizontal directions. For this purpose, it is sufficient if the range of motion of the second drive system 8 is relatively long in one horizontal direction and very short in the other horizontal direction. The range of motion in one direction is typically a few tens of millimeters, for example 20 mm or 30 mm or even more, the range of motion in the other direction is (only) a few micrometers.
    The nominal working position of the bondhead 3 is a position that deviates only slightly from the final position that the bondhead 3 assumes in the last step of the assembly process. The requirements for the accuracy with which the nominal working position is assumed are relatively low, since any deviation from the final working position is automatically compensated for later in the assembly process.
    The device is set up to lower the carrier 7 and / or the bondhead 3 and / or the component gripper 11 to such an extent that the underside of the component 1a is at an extremely low height of typically only 50-200 pm above the substrate surface , and only then take an image of the substrate marking (s) 23 with the substrate camera (s) 10. This ensures that the only movement after determining the actual position of the component 1 a in relation to its desired position on the substrate space and after performing the high-precision correction movements is only the lowering movement of the carrier 7 and / or the bonding head 3 and / or of the component gripper 11 and that this distance is so short that any shifts that occur in this lowering movement are in the u-direction and in the v-direction in the submicrometer range.
    From the point in time at which the carrier 7 has reached its position in the region of the substrate 2, the position of the substrate camera (s) 10 no longer changes relative to the substrate 2. From this point in time, only the position of the bonding head 3 is changed, namely by means of the second drive system 8. The position of the reference mark (s) 13 can therefore be monitored until the component 1 a is deposited on the substrate 2 and any, during the last phase of the Lowering of the component 1 a occurring deviation from its target position can be corrected. The components can therefore be assembled with a precision that has not been achieved in the submicrometer range.
    Fig. 2 illustrates a second embodiment of an inventive device, which is largely designed as the first embodiment, but with the essential difference that the second drive system 8 is formed, the bonding head 3 between the nominal working position and the stand-by To move position back and forth, but not for the high-precision correction movements, and that the device 5 for feeding and supplying the substrates 2 has a third drive system 16, which enables high-precision correction movements of the substrate 2 in at least two different horizontal directions. The second drive system 8 can therefore only move the bonding head 3 in a single direction running parallel to the surface of the substrates 2. However, the second drive system 8 can also optionally be designed to raise and lower the bonding head 3, i.e. to move in the direction orthogonal to the surface of the substrates 2. In contrast, the high-precision correction movements in the plane running parallel to the surface of the substrate 2 are carried out by the third drive system 16 in this exemplary embodiment. The third drive system 16 comprises a first drive for moving the substrate 2 along a first direction, again referred to as the u direction, and a second drive for moving the substrate 2 along a second direction, again referred to as the v direction. The directions u and v run in the horizontal direction and preferably orthogonally to one another. The third drive system 16 can also
    CH 713 732 A2 optionally have a rotary drive 15 which enables the substrate 2 to be rotated about an axis running perpendicular to the surface of the substrate 2 in order to eliminate any angular errors.
    With this device, a similarly high positioning accuracy can be achieved, even if during the last phase of lowering the component 1 a, further correction movements of the substrate 2 that may be necessary and carried out can no longer be checked for correct achievement.
    The assembly of a component 1 will now be explained in detail. The assembly method according to the invention comprises the following steps A to O. Some of the steps can be carried out in a different order.
    A) with the component gripper 11 picking up a component 1 from the feed unit 4.
    B) move the carrier 7 with the first drive system 6 to the component camera 9 or the component cameras 9, so that the reference marking or the reference markings 13 and the component 1a are in the field of view of the component camera 9 or in the field of view of the component cameras 9.
    In an assembly device in which the component camera (s) 9 is / are arranged in a stationary manner, step B is carried out by: with the first drive system 6 moving the carrier 7 to the component camera 9 or the component cameras 9. With an assembly device, in which the component camera (s) 9 is / are fastened to the carrier 7, step B is carried out by: moving the component camera (s) 9 and the bonding head 3 relative to one another into an image recording position.
    C) with the component camera 9 or the component cameras 9 taking one or more images.
    The components 1 contain component markings 22 (FIG. 3) or other structures that can be used as component markings. The component markings 22 serve to detect the position of the component 1 a with respect to the reference marking (s) 13 with the required accuracy.
    In an assembly device in which the component camera (s) 9 is / are attached to the carrier 7, step C is followed by the step: moving the component camera (s) 9 and the bonding head 3 relative to one another so that the bond head 3 is in its normal working position and, if applicable, the component camera (s) 9 are in a stand-by position.
    D) on the basis of the image recorded in the previous step or the images recorded in the previous step, determining a first correction vector which describes a deviation of the actual position of the component 1a from its target position related to the reference marking or the reference markings 13.
    The first correction vector comprises three components Δχ-ι, Ay-i and Αφ Ί , where Δχ-ι the displacement of a reference point of the component 1a in a first direction, referred to as the xi direction, and Ay-ι the displacement of the reference point of the Designate component 1 a in a second direction, referred to as the y direction, and Δφ Ί the rotation of component 1 a around the reference point of component 1 a with reference to reference mark (s) 13. The components Δχ Ί and Ay-ι are given in pixel coordinates of the component camera (s) 9, the component Δφ Ί is an angle. The first correction vector is a zero vector if the actual position of the component 1a already corresponds to its target position.
    E) calculating a first correction movement from the first correction vector.
    The first correction movement comprises three correction values Aui, Av-i and AO-i. The correction values Aui and Av-ι are calculated from the components Ax-i, Ay-ι and Δθ-ι. The correction value Δθ-ι is calculated from the angle error Δφ-ι. The correction values Aui, Av-i and Δθ-ι are all given in machine coordinates of the corresponding drives. The correction ranges Au-i and Av-i indicate the distances by which the second drive system 8 the bondhead 3 (in the device shown in FIG. 1) and the third drive system 16 the substrate 2 (in the FIG. 2 Device shown) must move in the direction designated as the u direction and in the direction referred to as the v direction, and the correction value Δθ-ι indicates the angle by which the drive 14 attached to the bondhead 3, the component gripper 11 or the rotary drive 15 Substrate 2 must rotate in order to eliminate the detected deviation of the actual position of the component 1a from its target position related to the reference mark (s) 13.
    F) with the first drive system 6 moving the carrier 7 to a position above a substrate location of the substrate 2.
    CH 713 732 A2
    G) Lowering the carrier 7 to a height above the substrate 2 at which the underside of the component 1a held by the component gripper 11 is at a predetermined distance D above the substrate location, the distance D being dimensioned such that both the reference marking (s ) 13 and the substrate marking (s) 23 are in the depth of field of the substrate camera (s) 10.
    The distance D is typically about 50-200 microns, but is not limited to these values. However, the distance D is so small that, when the component 1a is later lowered onto the substrate location, there are generally no displacements of the component 1a in the directions u and v which lead to a significant position error.
    H) with the second drive system 8 moving the bonding head 3 into a stand-by position.
    Steps F, G and H can be performed sequentially or simultaneously, i.e. in parallel with each other. The carrier 7 and thus also the substrate camera (s) 10 attached to the carrier 7 are no longer moved during the following remaining steps.
    The bond head 3 is usually in its nominal working position during steps A to G. In this, the substrate camera (s) 10 does not see the substrate marking (s) 23 because the bonding head 3 hides them. The position of the stand-by position is selected such that the bonding head 3 does not cover the substrate marking (s) 23.
    I) with the substrate camera (s) 10 taking a first image, the field of view of the substrate camera 10 or each of the fields of view of the substrate cameras 10 containing at least one substrate marking 23 arranged on the substrate 2.
    J) with the second drive system 8 moving the bonding head 3 into the nominal working position in which the field of view of the substrate camera 10 or each of the fields of view of the substrate cameras 10 contains at least one reference mark 13.
    K) with the substrate camera (s) 10 taking a second image.
    L) on the basis of the first and second images or the first and second images, which were recorded with the substrate camera (s) 10, determining a second correction vector which detects a deviation of the actual position of the substrate location from its position on the reference marking or describes the reference markings 13 related target position.
    The second correction vector comprises three components Ax 2 , Ay 2 and Δφ 2 , Ax 2 the displacement of the reference mark (s) 13 in a first direction, referred to as the x 2 direction, and Ay 2 the displacement of the reference mark (s) 13 in a second direction, referred to as the y 2 direction, and Δφ 2 denote the rotation of the reference mark (s) 13 with respect to the substrate location. The components Ax 2 and Ay 2 are given in pixel coordinates of the substrate camera (s) 10, the component Δφ 2 is an angle.
    M) Calculate a second correction movement from the second correction vector.
    [0035] The second correction movement comprises three correction values Au 2 , Av 2 and Δθ 2 . The correction values Au 2 and Av 2 are calculated from the components Ax 2 , Ay 2 and Arp 2 . The correction value Δθ 2 is calculated from the angle error Δφ 2 . The correction values Au 2 , Av 2 and Δθ 2 are all given in machine coordinates of the corresponding drives. The correction values Au 2 and Av 2 indicate the distances by which the second drive system 8 the bondhead 3 (in the device shown in FIG. 1) and the third drive system 16 the substrate 2 (in the device shown in FIG. 2) ) must move in the direction referred to as the u direction and in the direction referred to as the v direction, and the correction value Δθ 2 indicates the angle by which the drive 14 attached to the bondhead 3 rotates the component gripper 11 or the rotary drive 15 the substrate 2 in order to eliminate the detected deviation of the reference mark (s) 13 of the bonding head 3 from its desired position related to the substrate markings 23 of the substrate 2.
    N) Execution of the first and the second correction movement.
    The shifts by the correction values Aui, Av-i, Au 2 and Av 2 are carried out by the second drive system 8 in the device according to FIG. 1 and by the third drive system 16 in the device according to FIG. 2. The rotation around the correction values Δθ-ι and Δθ 2 is carried out by the drive 14 or the rotary drive 15.
    CH 713 732 A2
    O) Lowering the carrier 7 and / or the bonding head 3 and / or the component gripper 11 and placing the component 1a on the substrate location.
    If the assembly method is carried out with a device according to FIG. 1, the method can optionally also comprise steps P to T, which are carried out one or more times after step N:
    P) Taking an image with the substrate camera 10 or the substrate cameras 10.
    Q) using the image of the substrate camera 10 or the images of the substrate cameras 10 to determine the actual position (s) of the reference mark (s) 13.
    R) with the first correction vector, calculate a / of corrected actual position (s) of the reference mark 13 or the reference markings 13.
    The first correction movement calculated in step E and executed in step N for the bondhead 3 and the component gripper 11 also shifts the position of the reference mark (s) 13. This shift of the reference mark (s) 13 is calculated out in step R because the first correction movement has nothing to do with the alignment in relation to the substrate space.
    S) Determination of a further correction vector which describes the deviation of the corrected actual position (s) of the reference marking (s) 13 from its target position related to the substrate marking (s) 23.
    T) from the further correction vector, calculate a further correction movement for the bondhead 3 and the component gripper 11.
    The further correction movement for the bond head 3 and the component gripper 11 comprises components Au w , Av w , which are given in machine coordinates of the second drive system 8, and a component A0 w , which changes the angle in machine coordinates of the drive 14 or the rotary drive 15 is.
    U) with the second drive system 8 carry out the further correction movement for the bondhead 3 and with the drive 14 or the rotary drive 15 carry out the further correction movement for the component gripper 11.
    until each component of the further correction vector is smaller than a limit value assigned to the component.
    The optional steps P to U serve to check whether the bond head 3 has actually reached a position within the required accuracy after performing the correction movements in step N, and if this is not the case, iteratively carry out further correction steps until this is the case. The deviation recorded for each component must be within the required accuracy.
    Step O of the method according to the invention can be supplemented - in particular in the case of a device according to FIG. 1 - with monitoring in which the position of the reference mark (s) 13 by means of the substrate camera (s) 10 during the lowering of the carrier 7 or of the bondhead 3 or the component gripper 11 is continuously detected and stabilized by means of the second drive system 8 and the drive 14 or the rotary drive 15 in order to avoid a change in the position of the reference mark (s) 13 and thus of the component 1a. Step O can therefore be replaced by the following step 01:
    01) Lowering the carrier 7 and / or the bonding head 3 and / or the component gripper 11 and placing the component 1a on the substrate location, the position of the reference mark (s) 13 being continuously detected by means of the substrate camera 10 or the substrate cameras 10 during the lowering and is stabilized by means of the second drive system 8 and, optionally, also by means of the drive 14 or the rotary drive 15.
    The substrate camera or substrate cameras 10 (including the image evaluation) and the second drive system 8, possibly together with the drive 14 or the rotary drive 15, thus form a regulated movement axis.
    3 to 5 show snapshots during the assembly process according to the invention. The illustration is based on a mounting device which has a single component camera 9 and two substrate cameras 10, the two substrate cameras 10 being attached to the carrier 7 as mentioned.
    Fig. 3 shows a section of the mounting device after step B. Fig. 4 shows a section of the mounting device during step I, when the bondhead 3 is in the stand-by position, and the two substrate cameras 10 that take the first picture. 5 shows a section of the mounting device a little later
    CH 713 732 A2 during step K, when the bondhead 3 is in a position in which each of the fields of view of the two substrate cameras 10 contains at least one reference mark 13. The position of the substrate cameras 10 relative to the substrate 2 has not changed during the travel of the bonding head 3 from the state shown in FIG. 4 to the state shown in FIG. 5. 3 and 5 also illustrate the beam path 20 from the reference markings 13 to the image sensors 17 of the substrate cameras 10, while FIG. 4 illustrates the beam path 21 from the substrate markings 23 to the image sensors 17 of the substrate cameras 10.
    The placement of the substrate markings 23 on the substrates 2 is left to the users of the mounting device according to the invention. An automatic assembly machine with a single substrate camera 10 requires a different mutual arrangement of the reference mark (s) 13 on the bondhead 3 or on the component gripper 11 and the substrate markings 23 on the substrate 2. Since the components 1 are mostly rectangular, the component markings 22 are the reference mark (s) 13 and the substrate markings 23 are often arranged in two diagonally opposite corners of the rectangle or in two adjacent corners of the rectangle, since the highest accuracy can be achieved in this way.
    In the embodiment shown in FIGS. 3 and 4, the movement of the bondhead 3 from its nominal working position to the standby position takes place in a direction lying in the plane of the drawing. However, it can also take place in a direction perpendicular to the plane of the drawing.
    The term "component camera" is to be understood functionally, i.e. an optical deflection system can form a component camera together with the substrate camera, as is described in the published patent application CH 711 570 A1, which is incorporated by reference into this application. In such a case, a (single) camera and a first optical deflection system together form a first image acquisition system which makes it possible to take an image of the substrate location on which the component is to be mounted, and the camera, the first optical deflection system and a second optical The deflection system together form a second image acquisition system, which makes it possible to take an image of the underside of the component held by the bondhead. The first image acquisition system thus corresponds to the substrate camera and the second education acquisition system corresponds to the component camera. The first optical deflection system can also be omitted under certain circumstances.
    权利要求:
    Claims (9)
    [1]
    1. Device for mounting components (1; la) on a substrate (2), comprising a bondhead (3) with a component gripper (11), at least one reference marking (13) on the bondhead (3) or on the component gripper (11 ) is attached, a feed unit (4) for providing a component (1), a device (5) for providing a substrate (2), a first drive system (6) for moving a carrier (7), a second drive system (8) , which is attached to the carrier (7), for moving the bondhead (3) in one or more different directions, a drive (14) attached to the bondhead (3) for rotating the component gripper (11) about an axis (12) or a rotary drive (15) for rotating the substrate (2) about an axis, at least one substrate camera (10), and at least one component camera (9) or at least one optical deflection system which, together with the at least one substrate camera (10), forms at least one component camera , the su substrate camera (10) or the substrate cameras (10) is / are attached to the carrier (7), the carrier (7) and / or the bonding head (3) and / or the component gripper (11) can be raised and lowered, which Carrier (7) can be moved to the feed unit (4) by means of the first drive system (6), either the carrier (7) can be moved to the component camera (s) (9) by means of the first drive system (6) or the component camera ( s) (9) attached to the carrier (7) and pivotable relative to the bonding head (3), so that the reference mark (s) (13) and a component (la) held by the component gripper (11) are in the field of view of Component camera (9) or the fields of view of the component cameras (9) so that the actual position of the component (1a) in relation to the reference marking (s) (13) can be detected, the carrier (7) by means of the first drive system ( 6) movable over a substrate location of the substrate (2) and the bonding head (3) by means of the second drive system (8) in a stand-by position tion in which the field of view of the substrate camera (10) or each of the fields of view of the substrate cameras (10) contains at least one substrate marking (23) arranged on the substrate (2), and the bonding head (3) by means of the second drive system (8 ) movable into a nominal working position in which the field of view of the substrate camera (10) contains the reference mark (13) or each of the fields of view of the substrate cameras (10) at least one reference mark (13), and wherein the carrier (7) and / or the Bonding head (3) and / or the component gripper (11) can be lowered to such an extent that both the reference marking (s) (13) and the at least one substrate marking (23) are in the depth of field of the substrate camera (s) (10).
    [2]
    2. Device according to claim 1, in which the second drive system (8) is designed to move the bonding head (3) back and forth on the one hand between the nominal working position and the stand-by position and on the other hand to enable correction movements of the bonding head (3).
    CH 713 732 A2
    [3]
    3. Device according to claim 1 or 2, in which the substrate camera or substrate cameras (10) and the second drive system (8) and the drive (14) or the rotary drive (15) form a regulated movement axis.
    [4]
    4. The apparatus of claim 1, wherein the second drive system (8) is designed to reciprocate the bonding head (3) between the nominal working position and the stand-by position, and which has a third drive system (16), the corrective movements of the substrate (2).
    [5]
    5. Device according to one of claims 1 to 4, wherein the component camera (9) or the component cameras (9) attached to the carrier (7) and is / are movable relative to the bonding head (3).
    [6]
    6. A method for mounting components (1; 1 a) on a substrate (2) by means of a mounting device which a first drive system (6) for a carrier (7) and a second drive system (8) for a bonding head (3) a component gripper (11), at least one substrate camera (10) at least one component camera (9) or at least one optical deflection system, which together with the at least one substrate camera (10) forms the at least one component camera, and a drive (3) attached to the bondhead (3) 14) for rotating the component gripper (11) about an axis (12) or a rotary drive (15) for rotating the substrate (2) about an axis, the second drive system (8) and the substrate camera (s) (10) on Carriers (7) are fastened and the bonding head (3) or the component gripper (11) contains at least one reference marking (13), the method comprising the following steps:
    A) with the component gripper (11) picking up a component (1) from the feed unit (4),
    B) with the first drive system (6) move the carrier (7) to the component camera (9) or the component cameras (9), so that the reference marking or the reference markings (13) and the component (la) in the field of view of Component camera (9) or in the fields of view of the component cameras (9),
    C) taking one or more images with the component camera (9) or the component cameras (9),
    D) on the basis of the image recorded in the previous step or the images recorded in the previous step, determining a first correction vector which shows a deviation of the actual position of the component (la) from its target position related to the reference marking or the reference markings (13) describes,
    E) calculating a first correction movement from the first correction vector,
    F) with the first drive system (6) moving the carrier (7) to a position above a substrate location of the substrate (2),
    G) Lowering the carrier (7) to a height above the substrate (2) at which an underside of the component (1a) held by the component gripper (11) is located at a predetermined distance D above the substrate space, the distance D being so dimensioned is that both the reference mark (s) (13) and at least one substrate mark (23) arranged on the substrate (2) lie in the depth of field of the substrate camera (s) (10),
    H) with the second drive system (8) moving the bonding head (3) into a stand-by position,
    I) with the substrate camera (s) (10) taking a first image, the field of view of the substrate camera (10) or each of the fields of view of the substrate cameras (10) containing at least one substrate marking (23) arranged on the substrate (2) .
    J) with the second drive system (8) moving the bonding head (3) into a nominal working position in which the field of view of the substrate camera (10) or each of the fields of view of the substrate cameras (10) contains at least one reference mark (13),
    K) taking a second image with the substrate camera (s) (10),
    L) on the basis of the first and second image or the first and second images, which were recorded with the substrate camera (s) (10), determining a second correction vector which shows a deviation of the actual position of the substrate location from it onto the reference marking or describes the reference position (13) related target position,
    M) calculating a second correction movement from the second correction vector,
    N) Execution of the first and the second correction movement by means of the second drive system or a third drive system (16), which enables correction movements of the substrate (2), and by means of the drive (14) for rotating the component gripper (11) or the rotary drive (15) for rotating the substrate (2), and
    O) lowering the carrier (7) and / or the bonding head (3) and / or the component gripper (11) and placing the component (1a) on the substrate location.
    [7]
    7. The method according to claim 6, in which, after step N, the following steps are carried out one or more times:
    P) taking an image with the substrate camera (10) or the substrate cameras (10),
    Q) using the image of the substrate camera (10) or the images of the substrate cameras (10) to determine the actual position (s) of the reference marking (s) (13),
    R) calculating a corrected actual position of the reference mark or the reference markings (13) with the first correction vector,
    S) determining a further correction vector which describes a deviation of the corrected actual position of the reference marking or the reference markings (13) from their desired position relating to the substrate marking or substrate markings (23),
    CH 713 732 A2
    T) from the further correction vector, calculate a further correction movement for the bonding head (3) and the component gripper (11), and
    U) with the second drive system (8) performing the further correction movement for the bondhead (3) and with a drive (14) attached to the bondhead (3) for rotating the component gripper (11) about an axis (12) or a rotary drive ( 15) for the rotation of the substrate (2) about an axis, performing the further correction movement for the component gripper (11) until each component of the further correction vector is smaller than a limit value assigned to the component.
    [8]
    8. The method according to claim 6, in which the position of the reference mark (s) (13) is continuously detected by means of the substrate camera or the substrate cameras (10) in step O and is stabilized by means of the second drive system (8).
    [9]
    9. The method according to claim 6, wherein in step O during the lowering, the position of the reference mark (s) (13) is continuously detected by means of the substrate camera or the substrate cameras (10) and by means of the second drive system (8) and one on the bonding head ( 3) attached drive (14) for rotating the component gripper (11) about an axis (12) or a rotary drive (15) for rotating the substrate (2) about an axis is stabilized.
    CH 713 732 A2
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    法律状态:
    2021-08-16| AZW| Rejection (application)|
    优先权:
    申请号 | 申请日 | 专利标题
    CH5752017|2017-04-28|
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